The Chaoling laser cutting machine is mainly used for cutting and grooving monocrystalline silicon, polycrystalline silicon cells, and silicon wafers in the solar photovoltaic industry; The slicing and cutting of semiconductor substrate materials such as silicon, germanium, and gallium arsenide in the electronics industry. Compared with traditional YAG cutting machines, fiber laser has advantages such as high-quality beam quality, fast speed, low energy consumption, and long-term maintenance free. Due to the overall adoption of automatic controlThe manufacturing system, simple operation, and low maintenance make this machine highly efficient in production.

1Fiber optic output,Excellent laser mode and good engraving effect,High stability, more flexible and convenient.

2 A special optical isolation system is installed to avoid interference and possible damage to the laser caused by reflected light during the processing of highly reflective materials.

3 The laser has a long lifespan, can work continuously, is maintenance free, and has no consumables.

4 Suitable for brittle materials such as silicon wafers and ceramics.

5. The equipment adopts air cooling, which has low operating costs.